Principles of semiconductor test probes

The electroplated layer on the surface of the spring current charging pin not only protects the connector, but also improves the performance of some aspects. The electroplated layer is the protector of the normal use of the connector.

How to maintain the ICT test probes in the test fixture? Nowadays, the test probes are widely used by users, and various problems will inevitably occur. Then, Huaronghua Electronics will tell you how to maintain the test probes:

The new round of chip shortage has affected terminal industries such as automobiles, mobile phones, and consumer electronics. As the production capacity of chip foundries is difficult to expand rapidly, industry insiders believe that this round of chip shortages may not be alleviated until the end of next year.

Test pins, also called test probes in the industry, are divided into pogo pins (special pins) and general pins when used for PCB board testing. When pogo pins are used, a test mold needs to be made according to the wiring of the tested PCB board, and Under normal circumstances, a mold can only test one type of PCB board; when the universal pin is used, it only needs to have enough points, so many manufacturers now use the universal pin; the pogo pin is divided into PCB board probes according to the usage.