(1) Generally, the number of locks of SMA connectors is about 500 times (if the number of times of use is exceeded, please try to eliminate and replace them to avoid abnormal test);
(2) When manually disassembling the wire, please rotate the "hexagonal HEX part of the connector" to disassemble the wire or the adapter. Do not pull the sleeve with force to extend the life of the wire;
(3) When disassembling the wire with a torque wrench, please use a standard SMA torque wrench to lock and disassemble;
(4) When the wire connector or general adapter is not in use, please protect it with a protective cover to avoid damage to the connector or dust affecting the data value;
(5) It is necessary to wipe and clean the joints with alcohol cotton at ordinary times;
(6) All wires have a minimum bending radius, please do not exceed the specification radius to avoid damaging the characteristics of the wire;
2. Jig type probe maintenance method:
Please wipe and maintain with alcohol cotton after about 1000 times.
3. Product life:
(1) Generally, SMA connectors are used about 500 times;
(2) Please refer to the specifications of the various product specifications for the fixture type probe;
4. How to coordinate with the fixtures for production testing:
(1) To make the test more stable, please fix the 2/4 Hole probe on the fixture in a vertical manner;
(2) In order to prolong the life of the fixture probe, if it exceeds 2/3, it may cause a loss of durability;
Semiconductor test probes (high frequency needles) are mainly used in industries such as mobile phones, computers, and communications. Almost all major chip industries are promoted to use semiconductor test probes, and the major demand is the chip packaging and testing industry.
The electroplated layer on the surface of the spring current charging pin not only protects the connector, but also improves the performance of some aspects. The electroplated layer is the protector of the normal use of the connector.
How to maintain the ICT test probes in the test fixture? Nowadays, the test probes are widely used by users, and various problems will inevitably occur. Then, Huaronghua Electronics will tell you how to maintain the test probes:
The new round of chip shortage has affected terminal industries such as automobiles, mobile phones, and consumer electronics. As the production capacity of chip foundries is difficult to expand rapidly, industry insiders believe that this round of chip shortages may not be alleviated until the end of next year.
Test pins, also called test probes in the industry, are divided into pogo pins (special pins) and general pins when used for PCB board testing. When pogo pins are used, a test mold needs to be made according to the wiring of the tested PCB board, and Under normal circumstances, a mold can only test one type of PCB board; when the universal pin is used, it only needs to have enough points, so many manufacturers now use the universal pin; the pogo pin is divided into PCB board probes according to the usage.
